The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2009
Filed:
Dec. 14, 2006
John A. Winter, Pittsburgh, PA (US);
Charles S. Voeltzel, New Kensington, PA (US);
Cheryl E. Belli, New Kensington, PA (US);
James P. Thiel, Pittsburgh, PA (US);
John A. Winter, Pittsburgh, PA (US);
Charles S. Voeltzel, New Kensington, PA (US);
Cheryl E. Belli, New Kensington, PA (US);
James P. Thiel, Pittsburgh, PA (US);
PPG Industries Ohio, Inc., Cleveland, OH (US);
Abstract
A low temperature solder including indium in the range of 62-65 weight percent and tin in the range of 31-33 weight percent uses the heat generated during thermal treatment of one or more glass sheets to melt the solder. In one non-limiting embodiment, a lead providing external access to an electrical conductive arrangement, e.g. a conductive member between and connected to spaced bus bars between laminated sheets has an end portion of a connector, e.g. a lead soldered to each of the bus bars during thermal processing of the sheets, e.g. during the lamination of the sheets during a windshield manufacturing process. In another nonlimiting embodiment, the connector is soldered to the electrically conductive arrangement during the annealing of glass blanks following the heating and shaping of the glass blanks.