The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2009
Filed:
Jan. 23, 2009
Takami Hikita, Ibaraki, JP;
Kazunori Mune, Ibaraki, JP;
Toshiki Naitou, Ibaraki, JP;
Yasunari Ooyabu, Ibaraki, JP;
Takami Hikita, Ibaraki, JP;
Kazunori Mune, Ibaraki, JP;
Toshiki Naitou, Ibaraki, JP;
Yasunari Ooyabu, Ibaraki, JP;
Nitto Denko Corporation, Ibaraki-Shi, JP;
Abstract
A method of manufacturing an opto-electric hybrid board which is capable of reducing the number of steps for the manufacture of the opto-electric hybrid board and which achieves the reduction in thickness of the opto-electric hybrid board to be manufactured, and an opto-electric hybrid board obtained thereby. A plurality of protruding cores (optical interconnect lines)are formed in a predetermined pattern. Thereafter, a thin metal filmis formed in grooves defined between adjacent ones of the coresVia-filling plating is performed on the thin metal filmto fill the above-mentioned grooves with a via-filling plated layerThe plated layerserves as electrical interconnect lines