The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2009
Filed:
Apr. 21, 2005
Applicants:
Mark Steers, West Sussex, GB;
George W. Pearson, West Sussex, GB;
Inventors:
Mark Steers, West Sussex, GB;
George W. Pearson, West Sussex, GB;
Assignee:
International Rectifier Corporation, El Segundo, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A substrate, which has semiconductor die arranged thereon, uses at least one solder flow stop, closely surrounding at least a portion of at least one mounting pad on which the die are mounted, to prevent die rotation during solder reflow. The at least one solder stop is non-wetting, during a solder reflow process, to solder used to mount the die.