The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2009
Filed:
Oct. 16, 2006
Jeffrey Ming-jer Yang, Cerritos, CA (US);
Yun-ho Chung, Redondo Beach, CA (US);
Patty Chang-chien, Redondo Beach, CA (US);
Jeffrey Ming-Jer Yang, Cerritos, CA (US);
Yun-Ho Chung, Redondo Beach, CA (US);
Patty Chang-Chien, Redondo Beach, CA (US);
Northrop Grumman Space & Missions Systems Corp., Los Angeles, CA (US);
Abstract
An integrated packaging assembly for an MMIC that uses the semiconductor wafers on which circuit elements are fabricated as the package. The packaging assembly includes a plurality of semiconductor layers that have been diced from the semiconductor wafers, where the semiconductor layers can be made of different semiconductor material. The semiconductor layers define cavities therebetween in which circuit components are fabricated. A sealing ring seals the semiconductor layers together so as to hermetically seal the circuit components within the cavities.