The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2009
Filed:
Feb. 08, 2007
Ichiharu Kondoh, Nagoya, JP;
Ryuichiro Abe, Ichinomiya, JP;
Akitoshi Yamanaka, Hekinan, JP;
Yoshio Nakajima, Kariya, JP;
Ichiharu Kondoh, Nagoya, JP;
Ryuichiro Abe, Ichinomiya, JP;
Akitoshi Yamanaka, Hekinan, JP;
Yoshio Nakajima, Kariya, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A sensor includes: a semiconductor chip having a sensing portion and a first bump; a circuit chip having a second bump; and a resin film having a groove. The semiconductor chip and the circuit chip are integrated with sandwiching the resin film therebetween. The resin film includes a first space and a second space before the first bump is bonded to the second bump. The first space faces the sensing portion. The second space is disposed on a periphery of the first space. The resin film expands when the first bump is bonded to the second bump. The second space accommodates an expanded portion of the resin film. The first space provides the groove after the first bump is bonded to the second bump.