The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7615707 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 10, 2009

Filed:

Oct. 20, 2005
Applicant:

Yung-jen Lin, Taipei, TW;

Inventor:

Yung-Jen Lin, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01R 12/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A printed circuit board and a forming method for forming the printed circuit board are disclosed. The printed circuit board includes a substrate and a conductive layer. The substrate includes a through hole, wherein one side of the through hole of the substrate corresponds to a first diameter, and the other side of the through hole of the substrate corresponds to a second diameter. The second diameter is greater than the first diameter. The conductive layer is placed on the inner surface of the through hole for electrically connecting the two sides of the substrate.


Find Patent Forward Citations

Lin, Yung-Jen. (2009). Printed circuit board and forming method thereof (U.S. Patent No. 7615707). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7615707

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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