The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2009
Filed:
Aug. 21, 2006
Cheng-hsin Chen, Yuanlin Township, TW;
Kuang-cheng Kao, Taipei, TW;
Chen-yu Yang, Keelung, TW;
TPO Displays Corp., Chu-Nan, TW;
Abstract
A layout of a printed circuit board adaptive to be bonded to an integrated circuit device is introduced here. The layout includes a first metal layer, disposed in a first insulation layer and a second metal layer, disposed in a second insulation layer over the first insulation layer. The first metal layer and the second metal layer are connected to each other through a plurality of contact hole filled with conductive materials and are arranged to be substantially parallel to each other throughout a pad structure region and a line structure region of the printed circuit. The connected first metal layer and second metal layer are used for a signal path from the printed circuit board to the bonded integrated circuit device to improve driving ability of power supply.