The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2009
Filed:
Oct. 30, 2007
Mayuka Araumi, Tokyo, JP;
Mayuka Araumi, Tokyo, JP;
Ricoh Company, Ltd., Tokyo, JP;
Abstract
A method of manufacturing a multilevel interconnect structure using a screen printing method is disclosed. In the multilevel interconnect structure, an interlayer insulating film having a through hole with a conductive bump therein, and a second interconnect line are stacked on a substrate with a first interconnect line formed thereon. The first interconnect line is electrically connected to the second interconnect line via the conductive bump. The method includes a step of forming a first region of the interlayer insulating film on the substrate with the first interconnect line formed thereon, the first region including a part of a peripheral wall of the through hole; a step of forming a second region of the interlayer insulating film on the substrate with the first region formed thereon, the second region including a remaining part of the peripheral wall of the through hole; and a step of forming the conductive bump.