The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2009
Filed:
Dec. 01, 2005
Applicants:
Junichi Teraki, Kusatsu, JP;
Mitsuhiro Tanaka, Kusatsu, JP;
Inventors:
Junichi Teraki, Kusatsu, JP;
Mitsuhiro Tanaka, Kusatsu, JP;
Assignee:
Daikin Industries, Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/111 (2006.01); H01L 25/07 (2006.01); H01L 25/16 (2006.01); H05K 1/02 (2006.01); H05K 7/14 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
A power module includes a power semiconductor, a non-power semiconductor, one resin substrate, and a cooling device. The power semiconductor and the non-power semiconductor configure a power supply circuit for performing power conversion. Both the power semiconductor and the non-power semiconductor are mounted on the resin substrate. The cooling device is disposed in order to cool the power semiconductor.