The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2009

Filed:

Apr. 14, 2004
Applicants:

Masayuki Yoshida, Tokyo, JP;

Shunji Aoki, Tokyo, JP;

Junichi Sutoh, Tokyo, JP;

Genichi Watanabe, Tokyo, JP;

Inventors:

Masayuki Yoshida, Tokyo, JP;

Shunji Aoki, Tokyo, JP;

Junichi Sutoh, Tokyo, JP;

Genichi Watanabe, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a laminated type electronic part and aims at providing a sheet manufacturing method and a sheet that contribute to high integration, downsizing and enhancement of reliability of the electronic part. To accomplish this object, the manufacturing method according to the present invention involves forming a layer composed of a positive resist on a support body, repeatedly executing an exposure process, a developing process and a depositing process of depositing a substance having a desired electrical characteristic into an obtained pattern space with respect to the layer, and thereafter removing the support body. The sheet composed of portions, having three or more types of different physical properties, of which an aspect ratio in pattern is equal to or larger than 1, is provided by this manufacturing method.


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