The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2009
Filed:
Feb. 22, 2006
Eun Tae Park, Kyungki-do, KR;
Jeong Joo Kim, Daegu, KR;
Hee Young Lee, Daegu, KR;
Eun Sub Lim, Kyungsangnam-do, KR;
Jong Chul Lee, Kyungsangbook-do, KR;
Yul Kyo Chung, Kyungki-do, KR;
Eun Tae Park, Kyungki-do, KR;
Jeong Joo Kim, Daegu, KR;
Hee Young Lee, Daegu, KR;
Eun Sub Lim, Kyungsangnam-do, KR;
Jong Chul Lee, Kyungsangbook-do, KR;
Yul Kyo Chung, Kyungki-do, KR;
Samsung Electro-Mechanics Co., Ltd., Kyungki-Do, KR;
Abstract
The invention relates to a high-dielectric constant metal/ceramic/polymer composite material and a method for producing an embedded capacitor. As ceramic particles having a relatively small size are bound to the surface of metal particles having a relatively large size by mixing, the occurrence of percolation can be prevented without coating the metal particles, and at the same time, the capacitance of an embedded capacitor can be increased. In addition, a process for coating the surface of the metal particles can be omitted, thus contributing to the simplification of the overall preparation procedure.