The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2009
Filed:
Nov. 12, 2004
Yasuhide Onozawa, Kouza-gun, JP;
Yasuhide Onozawa, Kouza-gun, JP;
Epson Toyocom Corporation, Tokyo, JP;
Abstract
A surface-mount SAW device configured to prevent sealing resin layer coated all over the top surface of a piezoelectric substrate from becoming charged even if the piezoelectric substrate forming the SAW device is made of a pyroelectric material. The SAW device is composed of a mounting substrate; a SAW chip provided with a piezoelectric substrate, an IDT electrode formed on one surface of said piezoelectric substrate, and connection pads connected via conductor bumps to conductor traces; a flip chip mounted to the mounting substrate; and a sealing resin layer coated all over the outer surface of the SAW chip flip-chip mounted on the mounting substrate and extended down to the top surface of the mounting substrate to define an airtight space between the IDT electrode and the mounting substrate; and wherein the electrical conductivity of the piezoelectric substrate is increased to suppress charging of the sealing resin layer.