The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2009
Filed:
Sep. 26, 2005
Applicant:
Yutaka Takinomi, Kawasaki, JP;
Inventor:
Yutaka Takinomi, Kawasaki, JP;
Assignee:
Fujitsu Microelectronics Limited, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A relay board provided in a semiconductor package where a plurality of semiconductor chips are provided, the relay board relaying a wire for wiring the semiconductor chips or a wire for wiring a lead frame of the semiconductor package and the semiconductor chip, the relay board includes a plurality of wirings each of the wirings connecting at least three bonding pads.