The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2009

Filed:

Jan. 06, 2004
Applicants:

Martin Herman Weggen, Doetinchem, NL;

Michel Hendrikus Lambertus Teunissen, Herwen, NL;

Wilhelmus Gerardus Jozef Gal, Kilder, NL;

Inventors:
Assignee:

Fico B.V., Duiven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a device for encapsulating with encapsulating material an electronic component, in particular a semiconductor, fixed on a carrier, comprising: two co-acting mould parts which are displaceable relative to each other between an encapsulating position, in which the mould parts, when closing onto the carrier, occupy a position for defining at least one mould cavity, and an opened position in which the mould parts are situated at a greater distance from each other than in the encapsulating position, and feed means for encapsulating material connecting onto the mould cavity. The invention also relates to a method for encapsulating with encapsulating material an electronic component fixed on a carrier.


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