The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2009
Filed:
Mar. 26, 2004
Haruhiko Ikeda, Omihachiman, JP;
Haruhiko Ikeda, Omihachiman, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
In a process for producing the component-embedded substrate, a first electronic component is connected and fixed onto a first electrode pattern with a conductive bonding material, the first electrode pattern being provided on a first supporting layer. A second supporting layer including a second electrode pattern is press-bonded onto the electronic component-fixed surface of the first supporting layer with a first prepreg therebetween to perform transfer. Then, the first supporting layer and the second supporting layer are separated from the first prepreg. After separation, the first prepreg is cured. A second electronic component is connected and fixed onto the back surface of the second electrode pattern with a conductive bonding material. A third supporting layer including a third electrode pattern is press-bonded onto the second electronic component-fixed surface with a second prepreg therebetween to perform transfer. Then, the third supporting layer is separated from the second prepreg, and the second prepreg is cured. In this manner, the prepregs and electrode patterns are sequentially laminated, thereby reducing the connection resistance between laminated electrode patterns or between an electrode pattern and an electronic component.