The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2009

Filed:

May. 30, 2002
Applicants:

MY N. Nguyen, Poway, CA (US);

Nancy Dean, Libert Lake, WA (US);

Kenishiro Fukuyama, Spokane, WA (US);

Inventors:

My N. Nguyen, Poway, CA (US);

Nancy Dean, Libert Lake, WA (US);

Kenishiro Fukuyama, Spokane, WA (US);

Assignee:

Honeywell International Inc., Morristown, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

Layered interface materials described herein comprise at least one crosslinkable thermal interface component and at least one compliant fibrous interface component coupled to the thermal interface component. A method of forming layered interface materials comprises: a) providing a crosslinkable thermal interface component; b) providing a compliant fibrous interface component; and c) physically coupling the thermal interface component and the compliant fibrous interface component. At least one additional layer, including a substrate layer, can be coupled to the layered interface material.


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