The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2009

Filed:

Feb. 11, 2008
Applicants:

Kenichi Shirasaka, Hamamatsu, JP;

Yukitoshi Suzuki, Hamamatsu, JP;

Inventors:

Kenichi Shirasaka, Hamamatsu, JP;

Yukitoshi Suzuki, Hamamatsu, JP;

Assignee:

Yamaha Corporation, Hamamatsu-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device is equipped with a semiconductor sensor chip for detecting pressure variations that is arranged inside of a hollow cavity of a housing, wherein an opening is formed in a prescribed region of the housing, which is not positioned opposite to the semiconductor sensor chip, so as to allow the hollow cavity to communicate with an external space. The opening is formed using at least one through-hole having a thin slit-like shape. Alternatively, the opening is formed using plural through-holes each having a desired shape such as a thin slit-like shape, a circular shape, and a sectorial shape. Thus, it is possible to reduce negative influences due to environmental factors such as dust and sunlight with respect to the semiconductor sensor chip.


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