The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2009

Filed:

Feb. 12, 2008
Applicants:

Takashi Sawada, Sabae, JP;

Kenjiro Hadano, Sabae, JP;

Inventors:

Takashi Sawada, Sabae, JP;

Kenjiro Hadano, Sabae, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 1/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a monolithic electronic component in which a resistive element is incorporated by forming a resistor film on a terminal electrode, a plating film can be formed on the terminal electrode having the resistor film via electroplating in an efficient manner and with a uniform film thickness. In order to form the terminal electrode, the resistor film is disposed directly on the surface of the component body, and a conductive resin film having a relatively low volume resistivity is disposed over the resistor film. The conductive resin film is preferably adapted to have a specific resistance of less than about 1×10Ω·m, on which a plating film having a uniform film thickness can be formed efficiently via electroplating.


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