The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2009
Filed:
Sep. 11, 2006
Yoshio Fujii, Chiyoda-ku, JP;
Hiroshi Fukumoto, Chiyoda-ku, JP;
Shinpei Ogawa, Chiyoda-ku, JP;
Yoshinori Yokoyama, Chiyoda-ku, JP;
Yoshio Fujii, Chiyoda-ku, JP;
Hiroshi Fukumoto, Chiyoda-ku, JP;
Shinpei Ogawa, Chiyoda-ku, JP;
Yoshinori Yokoyama, Chiyoda-ku, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
An upper sealing ring and a lower sealing ring are adhered by sealing solder. The width of tip end of sealing projection is narrower than the width of the lower sealing ring. Therefore, the sealing solder is placed on lower sealing ring and on the side surface of upper sealing ring. Further, an upper connection pad and a lower connection pad are adhered by connecting solder. The width of a tip end of a connection projection is narrower than the width of lower connection pad. Therefore, the connecting solder is placed on the lower connection pad and on the side surface of upper connection pad. Thus, a package is provided, which attains satisfactory electrical connection and hermetic seal after solder joint of the upper and lower substrates.