The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2009
Filed:
Jul. 21, 2006
Applicant:
Kazuyoshi Murotani, Tokyo, JP;
Inventor:
Kazuyoshi Murotani, Tokyo, JP;
Assignee:
Sumitomo Bakelite Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/36 (2006.01); C08L 63/04 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract
There is provided an epoxy resin composition for encapsulating a semiconductor essentially comprising (A) a phenolaralkyl type epoxy resin having a phenylene structure, (B) a phenolaralkyl resin having a biphenylene structure, (C) a curing accelerator containing an adduct of a phosphine compound and a quinone compound, (D) a compound in which hydroxyl groups are attached to each of two or more adjacent carbon atoms of an aromatic ring, (E) a silane coupling agent and (F) an inorganic filler, wherein the inorganic filler (F) is contained in 84 wt % to 92 wt % both inclusive in the total amount of the epoxy resin composition.