The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2009
Filed:
Feb. 13, 2004
Hiroya Okumura, Ashiya, JP;
Keizo Kimura, Mino, JP;
Shinji Tachibana, Sodegaura, JP;
Takeshi Kusagaya, Shizuoka, JP;
Hiroya Okumura, Ashiya, JP;
Keizo Kimura, Mino, JP;
Shinji Tachibana, Sodegaura, JP;
Takeshi Kusagaya, Shizuoka, JP;
Japan Composite Co., Ltd., Chuo-Ku, Tokyo, JP;
Abstract
An electroconductive plate is prepared by molding an electroconductive resin composition comprising an electroconductive agent and a radical-polymerizable thermosetting resin system having an acid value in a specific range by a resin molding method. The electroconductive agent may be a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin and a radical-polymerizable diluent. The double bond equivalent of the radical-polymerizable resin is preferably about 200 to 1000. The glass transition temperature of the hardened product is preferably not lower than 120° C. The proportion (weight ratio) of the electroconductive agent relative to the radical-polymerizable thermosetting resin system [the former/the latter] is about 55/45 to 95/5.