The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2009
Filed:
Jun. 01, 2007
Kazutaka Matsumoto, Kanagawa-ken, JP;
Masahiro Tadauchi, Kanagawa-ken, JP;
Izuru Komatsu, Kanagawa-ken, JP;
Kazutaka Matsumoto, Kanagawa-ken, JP;
Masahiro Tadauchi, Kanagawa-ken, JP;
Izuru Komatsu, Kanagawa-ken, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high heat resistant strength at a high temperature possible and a paste containing the flux and a non-lead type solder paste and with respect to the thermosetting flux, an epoxy resin, a hardening agent, and at least one of rosin derivatives having functional groups reactive on the epoxy resin and selected from maleic acid-modified rosin, a fumaric acid-modified rosin, and acrylic acid-modified rosin are used. The flux can be used in form of a solder paste while being mixed and kneaded with the non-lead type solder alloy powder.