The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2009
Filed:
Nov. 28, 2005
Wolfgang Jacob, Horb, DE;
Christoph Ruf, Eningen, DE;
Albert-andreas Hoebel, Reutlingen, DE;
Rolf Becker, Pfullingen, DE;
Wolfgang Jacob, Horb, DE;
Christoph Ruf, Eningen, DE;
Albert-Andreas Hoebel, Reutlingen, DE;
Rolf Becker, Pfullingen, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
The invention relates to a method for producing an electronic circuit. According to said method, two semiconductor chips () with essentially the same structure are mounted on a surface () pertaining to a first conductor carrier () and coated with strip conductors (). Said two semiconductor chips () comprise a first surface () and a second surface (), one semiconductor chip () being mounted on the conductor carrier surface () with the first surface () thereof, and the other semiconductor chip () being mounted on the conductor carrier surface () with the second surface () thereof. The second surface () of the first semiconductor chip () and the first surface () of the other semiconductor chip () are interconnected by a lead frame () with an A.C. power supply ().