The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2009
Filed:
Jul. 31, 2003
Mitsuo Kuwabara, Tsurugashima, JP;
Tadashi Okada, Saitama, JP;
Naoji Yamamoto, Shizuoka-ken, JP;
Masahito Hasuike, Hamamatsu, JP;
Hideo Yoshikawa, Shizuoka-ken, JP;
Michiharu Hasegawa, Mie-ken, JP;
Tetsuaki Aoki, Kumamoto-ken, JP;
Masanori Kogawa, Kumamoto-ken, JP;
Kazunori Sakamoto, Kumamoto-ken, JP;
Keizou Tanoue, Kumamoto, JP;
Mitsuo Kuwabara, Tsurugashima, JP;
Tadashi Okada, Saitama, JP;
Naoji Yamamoto, Shizuoka-ken, JP;
Masahito Hasuike, Hamamatsu, JP;
Hideo Yoshikawa, Shizuoka-ken, JP;
Michiharu Hasegawa, Mie-ken, JP;
Tetsuaki Aoki, Kumamoto-ken, JP;
Masanori Kogawa, Kumamoto-ken, JP;
Kazunori Sakamoto, Kumamoto-ken, JP;
Keizou Tanoue, Kumamoto, JP;
Honda Giken Kogyo Kabushiki Kaisha, Tokyo, JP;
Abstract
A metal material comprises a Zn—Al—Sn based alloy (ZAS alloy) and Cu diffused in the alloy, wherein Cu is diffused into the inside of the alloy to a depth from the surface of 0.5 mm or more, the concentration of Cu decreases from the surface of the ZAS alloy towards the inside thereof, and there is present no specific interface between Cu and the ZAS alloy; and a method for producing the metal material involves applying, to the surface of the ZAS alloy, an agent comprising a solvent and, dispersed therein, a material containing Cu such as a Cu powder and a Cu—Mn alloy powder and preferably, dispersed or dissolved therein, a reducing agent capable of reducing an oxide film present on the surface of the ZAS alloy, and heating the ZAS alloy having the agent applied thereon, to thereby diffuse Cu into the alloy.