The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2009
Filed:
May. 29, 2007
Johnathan L. Barnes, Richmond, KY (US);
Craig M. Bertelsen, Union, KY (US);
Brian C. Hart, Georgetown, KY (US);
Gary R. Williams, Lexington, KY (US);
Sean T. Weaver, Union, KY (US);
Girish S. Patil, Lexington, KY (US);
Johnathan L. Barnes, Richmond, KY (US);
Craig M. Bertelsen, Union, KY (US);
Brian C. Hart, Georgetown, KY (US);
Gary R. Williams, Lexington, KY (US);
Sean T. Weaver, Union, KY (US);
Girish S. Patil, Lexington, KY (US);
Lexmark International, Inc., Lexington, KY (US);
Abstract
A method of making a micro-fluid ejection head structure for a micro-fluid ejection device. The method includes applying a removable mandrel material to a semiconductor substrate wafer containing fluid ejection actuators on a device surface thereof. The mandrel material is shaped to provide fluid chamber and fluid channel locations on the substrate wafer. A micro machinable material is applied to the shaped mandrel and the device surface of the wafer to provide a nozzle plate and flow feature layer on the shaped mandrel and wafer. A plurality of nozzle holes are formed in the nozzle plate and flow feature layer. The shaped mandrel material is then removed from the device surface of the substrate wafer to provide fluid chambers and fluid channels in the nozzle plate and flow feature layer.