The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2009
Filed:
Jun. 16, 2006
Yiu Sing Ho, Ma On Shan Shatin, HK;
Hiroshi Fukaya, Tai Koo Shing, HK;
Kam Fung Yip, Tuen Mun, HK;
Satoshi Yamaguchi, Kowloon, HK;
Jeffery L. Wang, Tai Po, HK;
Can Hua Chen, Dongguan, CN;
Yiu Sing Ho, Ma On Shan Shatin, HK;
Hiroshi Fukaya, Tai Koo Shing, HK;
Kam Fung Yip, Tuen Mun, HK;
Satoshi Yamaguchi, Kowloon, HK;
Jeffery L. Wang, Tai Po, HK;
Can Hua Chen, Dongguan, CN;
SAE Magnetics (H.K.) Lts., Shatin, N.T., HK;
Abstract
A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.