The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2009
Filed:
Jan. 24, 2003
Akihiko Okubora, Kanagawa, JP;
Akihiko Okubora, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
A high-frequency module having a communication function is provided which includes a base substrate block () formed from organic substrates (), the organic substrate () having wiring layers () formed on main sides, respectively, thereof while the organic substrate () has wiring layers () formed on main sides, respectively, thereof, the base substrate block () having a buildup surface formed by flattening an uppermost layer, and an elements block () formed from organic insulative layers () formed on the buildup surface of the base substrate block () and in which a plurality of conductive parts () forming passive elements and distributed parameter elements, which transmit a high-frequency signal, are formed along with wiring layers (). The conductive parts () in the elements block () are formed correspondingly to portions of the organic substrate () in the base substrate block () where no woven glass fabric is laid.