The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2009
Filed:
Feb. 16, 2007
Girish Upadhya, Cupertino, CA (US);
Mark Munch, Los Alos Hills, CA (US);
Norman Chow, Milpitas, CA (US);
Paul Tsao, Los Altos, CA (US);
Douglas E. Werner, Santa Clara, CA (US);
Mark Mcmaster, Menlo Park, CA (US);
Frederic Landry, San Francisco, CA (US);
Ian Spearing, Westerville, OH (US);
Tim Schrader, Irwin, OH (US);
Girish Upadhya, Cupertino, CA (US);
Mark Munch, Los Alos Hills, CA (US);
Norman Chow, Milpitas, CA (US);
Paul Tsao, Los Altos, CA (US);
Douglas E. Werner, Santa Clara, CA (US);
Mark McMaster, Menlo Park, CA (US);
Frederic Landry, San Francisco, CA (US);
Ian Spearing, Westerville, OH (US);
Tim Schrader, Irwin, OH (US);
Cooligy Inc., Mountain View, CA (US);
Abstract
Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.