The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2009
Filed:
May. 21, 2008
Thomas G. Bensing, Sunnyvale, CA (US);
Adalberto M. Ramirez, Hayward, CA (US);
Jens Ullmann, San Jose, CA (US);
Jacob Herschmann, Palo Alto, CA (US);
Robert J. Sylvia, Santa Clara, CA (US);
Maurice C. Evans, Oakland, CA (US);
Thomas G. Bensing, Sunnyvale, CA (US);
Adalberto M. Ramirez, Hayward, CA (US);
Jens Ullmann, San Jose, CA (US);
Jacob Herschmann, Palo Alto, CA (US);
Robert J. Sylvia, Santa Clara, CA (US);
Maurice C. Evans, Oakland, CA (US);
Qualitau, Inc., Sunnyvale, CA (US);
Abstract
A strip-shaped package is provided that can accept a single die up to many dice. Conduction paths are printed (or otherwise integrally formed) thereon to the edge of the package, and a complementary socket may be provided that, in combination with the strip-shaped package, provides for electrical connection to test electronics without the use of package leads. The strip-shaped package may be made of ceramic or other temperature resistant material. The strip-shaped package may have at least one 'well' location in which the die or dice may be affixed to the strip-shaped package. The strip may have notches configured to function as separators between the individual die housings (and related integrally-formed conduction paths).