The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7598604 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 06, 2009

Filed:

Oct. 19, 2006
Applicant:

Ryoji Matsushima, Yokkaichi, JP;

Inventor:

Ryoji Matsushima, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/06 (2006.01); H01R 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A first semiconductor element and a second semiconductor element each have an electrode forming surface with an electrode pad thereon. The first semiconductor element and the second semiconductor element are stacked to expose each electrode pad and bonded while facing the electrode forming surfaces each other. The electrode pads of the first and second semiconductor elements are connected to the first and second connection terminals via bonding wires. A metal circuit board including the first and second connection terminals, and the first and second semiconductor elements are sealed by a sealing material such that parts of the respective connection terminals expose.


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Matsushima, Ryoji. (2009). Low profile semiconductor package (U.S. Patent No. 7598604). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7598604

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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