The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2009
Filed:
Oct. 24, 2005
Jin Woo Jeong, Daegu, KR;
Dae Jun Kim, Daejeon, KR;
Sang Kuk Choi, Daejeon, KR;
Dae Yong Kim, Daejeon, KR;
Ho Seob Kim, Chungcheongnam-do, KR;
Jin Woo Jeong, Daegu, KR;
Dae Jun Kim, Daejeon, KR;
Sang Kuk Choi, Daejeon, KR;
Dae Yong Kim, Daejeon, KR;
Ho Seob Kim, Chungcheongnam-do, KR;
Electronics and Telecommunications Research Institute, Daejeon, KR;
Industry-University Cooperation Foundation Sunmoon University, Chungcheongnam-do, KR;
Abstract
Provided is a wafer-scale microcolumn array using a low temperature co-fired ceramic (LTCC) substrate. The microcolumn array includes a LTCC substrate having wirings and wafer-scale beam deflector arrays, which are attached to at least one side of the LTCC substrate and has an array of deflection devices deflecting electron beams. The wafer-scale microcolumn array using the LTCC substrate makes it possible to significantly increase the throughput of semiconductor wafers, simplify its manufacturing process, and lower its production cost.