The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2009

Filed:

May. 02, 2006
Applicants:

Chun Chieh Yang, Hsinchu Hsien, TW;

Hong-xi Cao, Hsinchu, TW;

Chia-tai Kuo, Hsinchu, TW;

Chih-li Chen, Hsinchu, TW;

Cheng-fa Chen, Hsinchu, TW;

Ji-bin Horng, Hsinchu, TW;

Inventors:

Chun Chieh Yang, Hsinchu Hsien, TW;

Hong-Xi Cao, Hsinchu, TW;

Chia-Tai Kuo, Hsinchu, TW;

Chih-Li Chen, Hsinchu, TW;

Cheng-Fa Chen, Hsinchu, TW;

Ji-Bin Horng, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2006.01); H01L 31/0256 (2006.01);
U.S. Cl.
CPC ...
Abstract

A high power LED has at least a porous material layer, a thermal conductive layer and a chip. The thermal conductive layer is disposed on the surface of the porous material layer and the chip is disposed on the thermal conductive layer. Heat generated by the chip is conducted from the thermal conductive layer to the porous material layer, and convected outside via the porous material layer. Thereby, surface area in contact with the air is increased and high thermal conductivity and high heat convection are also achieved.


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