The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2009
Filed:
Mar. 30, 2006
Semiconductor chip having a soldering layer sequence, and process for soldering a semiconductor chip
Andreas Ploessl, Regensburg, DE;
Stefan Illek, Donaustauf, DE;
Vincent Grolier, Regensburg, DE;
Osram Opto Semiconductors GmbH, Regensburg, DE;
Abstract
A semiconductor chip (), to which a layer sequence () intended for the production of a soldered connection has been applied. The layer sequence () comprises a solder layer () and an oxidation prevention layer (), which follows the solder layer () as seen from the semiconductor chip (). A barrier layer () is included between the solder layer () and the oxidation prevention layer (). This prevents a constituent of the solder layer () from diffusing through the oxidation prevention layer () prior to the soldering operation, where it would effect oxidation that is disadvantageous for producing a soldered connection.