The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2009
Filed:
May. 14, 2007
Applicants:
Chih-hung Wu, Taoyuan County, TW;
Chieh Cheng, Taoyuan County, TW;
Kai-sheng Chang, Taoyuan County, TW;
Kuan-yu Chu, Taoyuan County, TW;
Inventors:
Chih-Hung Wu, Taoyuan County, TW;
Chieh Cheng, Taoyuan County, TW;
Kai-Sheng Chang, Taoyuan County, TW;
Kuan-Yu Chu, Taoyuan County, TW;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wafer stacked on a mounting layer is safely diced. The mounting layer has holes partially corresponding to chips on the wafer. Thus, chips obtained after dicing the wafer can be safely removed from the mounting tape. An amount of the mounting tape used can be reduced. And a production cost can be lowered as well.