The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7597829 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 06, 2009

Filed:

Dec. 27, 2004
Applicants:

Atsushi Yusa, Ibaraki, JP;

Terumasa Kondo, Nagano, JP;

Toshiyuki Tomita, Matsudo, JP;

Masami Suzuki, Matsudo, JP;

Inventors:

Atsushi Yusa, Ibaraki, JP;

Terumasa Kondo, Nagano, JP;

Toshiyuki Tomita, Matsudo, JP;

Masami Suzuki, Matsudo, JP;

Assignee:

Hitachi Maxell, Ltd., Ibaraki-shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/04 (2006.01); B29C 45/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

An injection molding method that modifies a surface of thermoplastic resin using a supercritical fluid that contains a solute, and molds the thermoplastic resin, includes the steps of injecting the thermoplastic resin into a mold cavity in a mold, a space being formed between the mold cavity and the surface of the thermoplastic resin, introducing into the space the supercritical fluid that contains the solute, and exhausting from the space the supercritical fluid that contains the solute.


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Yusa, Atsushi. (2009). Injection molding method and apparatus (U.S. Patent No. 7597829). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7597829

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