The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2009
Filed:
Oct. 02, 2007
Toshihiko Kaneda, Hakusan, JP;
Satoshi Kimura, Fujimi, JP;
Hidemichi Furihata, Chino, JP;
Takeshi Kijima, Matsumoto, JP;
Toshihiko Kaneda, Hakusan, JP;
Satoshi Kimura, Fujimi, JP;
Hidemichi Furihata, Chino, JP;
Takeshi Kijima, Matsumoto, JP;
Seiko Epson Corporation, , JP;
Abstract
A method of manufacturing an element substrate including: forming a release layer on a first support substrate; forming a metal layer having a predetermined pattern on the release layer; disposing a second support substrate on the first support substrate so that the metal layer is interposed between the first and second support substrates; pouring a resin material in a fluid state between the first and second support substrates; curing the resin material to form a resin substrate; and removing the metal layer from the first support substrate by decomposing the release layer to transfer the metal layer to the resin substrate.