The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2009
Filed:
Sep. 23, 2005
Tomoyuki Abe, Kawasaki, JP;
Yasuo Yamagishi, Kawasaki, JP;
Tomoyuki Abe, Kawasaki, JP;
Yasuo Yamagishi, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A method for manufacturing an electronic component-mounted board (X) includes a temperature raising step for heating an electronic component (A), with a solder bump electrode () containing a solder material, to a first temperature higher than the melting point of the solder material, while also heating a wiring board (X'), with an electrode section () corresponding to the solder bump electrode (), to a second temperature lower than the first temperature. The method further includes a joining step for joining the solder bump electrode () and the electrode section () by pressing the electronic component (A) against the wiring board (X′), with the solder bump electrodes () and the electrode sections () abutting against each other.