The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2009
Filed:
Jan. 04, 2006
Naoki Ishikawa, Kawasaki, JP;
Tatsuro Tsuneno, Inagi, JP;
Hidehiko Kira, Kawasaki, JP;
Hiroshi Kobayashi, Kawasaki, JP;
Naoki Ishikawa, Kawasaki, JP;
Tatsuro Tsuneno, Inagi, JP;
Hidehiko Kira, Kawasaki, JP;
Hiroshi Kobayashi, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Fujitsu Frontech Limited, Tokyo, JP;
Abstract
The present invention provides an IC chip mounting method for mounting two or more IC chips on a base, including: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; sequentially pressing the IC chips on the wafer against a first roller to allow the chips to be sucked onto the first roller; subsequently transferring the IC chips sucked onto the first roller to a second roller; and subsequently mounting the IC chips transferred to the second roller on the traveling base.