Tape bonder, tape bonding method, and process for manufacturing electronic component

Abstract

A tape bonding device for bonding a tape member to a work piece: having a rubber sheet on the upper surface of which the work piece is mounted, a first vacuum chamber located on the side of the upper surface of the rubber sheet, a second vacuum chamber located on the side of the lower surface of the rubber sheet, a holding member which holds the rubber sheet without coming and going of the air between a first and a second vacuum chambers and, a tape holding unit which holds the tape member in a stretched state, and locates the tape member in the upper portion of the work piece, a first sucking unit which performs vacuum suction of a first vacuum chamber, a first air introducing unit which introduces the air into the first vacuum chamber, a second sucking unit which performs vacuum suction of a second vacuum chamber, a second air introducing unit which introduces the air into the second vacuum chamber.