The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2009
Filed:
Jan. 19, 2007
Sadaki Satoh, Tokyo, JP;
Masashi Gotoh, Tokyo, JP;
Ken Kikuchi, Tokyo, JP;
Takeshi Itoh, Tokyo, JP;
Takuo Kataho, Tokyo, JP;
Sadaki Satoh, Tokyo, JP;
Masashi Gotoh, Tokyo, JP;
Ken Kikuchi, Tokyo, JP;
Takeshi Itoh, Tokyo, JP;
Takuo Kataho, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
A molding die unit has a shell and a die. The die is located inside the shell. A die hole is formed in the die. The die has first and second portions. The first and second portions include their respective surfaces defining the die hole and facing each other. A first through hole is formed in the shell and penetrates so as to open in an outside surface and in an inside surface of the shell. A second through hole continuing to the first through hole is formed at a position corresponding to the first through hole and in the first portion. The second through hole includes a first region and a second region. The first region opens in a surface of the first portion facing the inside surface of the shell and has a first sectional area. The second region opens in the surface defining the die hole and has a second sectional area smaller than the first sectional area.