The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2009
Filed:
Oct. 23, 2007
Benjamin N. Eldridge, Danville, CA (US);
Gary W. Grube, Pleasanton, CA (US);
Eric D. Hobbs, Livermore, CA (US);
Gaetan L. Mathieu, Vareness, CA (US);
Makarand S. Shinde, Livermore, CA (US);
Alexander H. Slocum, Bow, NH (US);
A. Nicholas Sporck, Saratoga, CA (US);
Thomas N. Watson, Pleasanton, CA (US);
Benjamin N. Eldridge, Danville, CA (US);
Gary W. Grube, Pleasanton, CA (US);
Eric D. Hobbs, Livermore, CA (US);
Gaetan L. Mathieu, Vareness, CA (US);
Makarand S. Shinde, Livermore, CA (US);
Alexander H. Slocum, Bow, NH (US);
A. Nicholas Sporck, Saratoga, CA (US);
Thomas N. Watson, Pleasanton, CA (US);
FormFactor, Inc., Livermore, CA (US);
Abstract
A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.