The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2009
Filed:
Jul. 26, 2006
Christopher Lee Kauffman, Lake Zurich, IL (US);
Gerald Pray Griffith, Western Springs, IL (US);
Ronald B. Jones, Mundelein, IL (US);
Sung-shik Yoo, Palatine, IL (US);
Michael A. Davis, Barrington, IL (US);
Christopher Lee Kauffman, Lake Zurich, IL (US);
Gerald Pray Griffith, Western Springs, IL (US);
Ronald B. Jones, Mundelein, IL (US);
Sung-Shik Yoo, Palatine, IL (US);
Michael A. Davis, Barrington, IL (US);
Northrop Grumman Corporation, Los Angelas, CA (US);
Abstract
A multi-band focal plane array architecture operative to detect multiple spectral image. The multi-band focal plane array architecture has an integrated readout circuit, a plurality of first detectors integrated in the readout circuit and a plurality of second detectors deposited on the readout circuit. Preferably, the first detectors are operative to detect visible signals and the second detectors are operative to detect infrared signals. The first and second detectors are arranged in a checkerboard pattern, in alternate rows or columns, or at least partially overlapped with each other to realize simultaneous detection in two different wavelength bands. The architecture may also have an additional integrated readout circuit flip-chip bonded to the integrated readout circuit. By forming a plurality of third detectors on the additional integrated readout circuit, a tri-band focal plane array may be realized. In one embodiment, a dual-band focal plane array architecture by forming two arrays of detectors on two individual integrated readout circuit and flip-chip bonding these two readout circuits.