The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2009
Filed:
Aug. 04, 2005
Norio Kashiwa, Sodegaura, JP;
Shingo Matsuo, Sodegaura, JP;
Shinichi Kojoh, Sodegaura, JP;
Mamoru Takahashi, Sodegaura, JP;
Norio Kashiwa, Sodegaura, JP;
Shingo Matsuo, Sodegaura, JP;
Shinichi Kojoh, Sodegaura, JP;
Mamoru Takahashi, Sodegaura, JP;
Mitsui Chemicals, Inc., Minato-ku, Tokyo, JP;
Abstract
The present invention provides ethylene polymers capable of preparing various molded articles such as films, sheets or the like, and having excellent moldability, particularly excellent high-speed moldability. The ethylene polymers of the present invention have a density and molecular weight distribution in specific ranges. The first ethylene polymer is characterized by having (C) a ratio (MFR/MFR) of a melt flow rate (MFR) at 190° C. under a load of 10 Kg to a melt flow rate (MFR) at 190° C. under a load of 2.16 Kg of from 16.2 to 50. The second ethylene polymer is characterized by having (C) a ratio (MFR/MFR) from 12 to 50. The third ethylene polymer is characterized by having (D) a relation of ω2/ω1≧18 where ω1 and ω2 denote angular velocity (rad/sec) when complex elastic modulus G* (dyne/cm) at 200° C. is 5.0×10dyne/cmand 2.0×10dyne/cm, respectively, which are determined by measurement of the angular velocity dependence of the complex elastic modulus of the copolymer.