The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2009
Filed:
Feb. 07, 2003
Markus Rogalla, Krozingen, DE;
Ingo Freund, Vogtsburg-Oberrrottweil, DE;
Mirko Lehmann, Freiburg, DE;
Markus Rogalla, Krozingen, DE;
Ingo Freund, Vogtsburg-Oberrrottweil, DE;
Mirko Lehmann, Freiburg, DE;
Micronas GmbH, Freiburg, DE;
Abstract
In a method for producing a sensor arrangement and the resulting sensor arrangement, a sensor is provided on or in a chip and the chip is covered with a protective cover, the cover being an interface between the sensor and the environment. An adhesive layer is provided between the chip and the protective cover, the adhesive layer alone or together with the protective cover being an interface between the sensor and the environment. The protective cover and/or the adhesive layer may have a channel formed therein, the channel functioning as the reception channel for a sensor. In an alternative embodiment, the protective cover placed on a wafer with several chips, and the wafer is cut up to produce the individual chips with the protective cover. Thus, a sensor arrangement may have the protective cover applied to the individual chip after the chip is cut from the wafer, or the protective cover may be applied to the wafer, and the wafer and cover are then cut up into the individual chips and corresponding covers. The channel leading from one side of the arrangement to the sensor may be taken through the adhesive layer, through the protective cover, or through both. A hole may be formed in the protective cover above the sensor, with the sensor lying loosely in the hole. The reaction volume may be determined by the dimensions of the hole.