The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2009

Filed:

Apr. 03, 2006
Applicants:

James D. B. Smith, Monroeville, PA (US);

Gary Stevens, Surrey, GB;

John W. Wood, Winter Springs, FL (US);

Inventors:

James D. B. Smith, Monroeville, PA (US);

Gary Stevens, Surrey, GB;

John W. Wood, Winter Springs, FL (US);

Assignee:

Siemens Energy, Inc., Orlando, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In one embodiment the present invention provides for a method of forming HTC dendritic fillerswithin a host resin matrix that comprises adding HTC seedsto the host resin matrix. The HTC seeds have been surface functionalized to not substantially react with one another. The seeds then accumulate HTC building blocks, and the HTC building blocks have also been surface functionalized to not substantially react with one another. Then assembling the HTC building blocks with the HTC seeds to produce HTC dendritic fillerswithin the host resin matrix.


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