The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2009
Filed:
Nov. 28, 2003
Tsuneo Takano, Aichi-ken, JP;
Akitada Yanase, Aichi-ken, JP;
Tadashi Sakai, Tokyo, JP;
Kiharu Numata, Aichi-ken, JP;
Akihiro Ito, Aichi-ken, JP;
Masato Taguchi, Tokyo, JP;
Junichi Muramatsu, Aichi-ken, JP;
Kazuya Goto, Irvine, CA (US);
Kazuki Koga, Aichi-ken, JP;
Tsuneo Takano, Aichi-ken, JP;
Akitada Yanase, Aichi-ken, JP;
Tadashi Sakai, Tokyo, JP;
Kiharu Numata, Aichi-ken, JP;
Akihiro Ito, Aichi-ken, JP;
Masato Taguchi, Tokyo, JP;
Junichi Muramatsu, Aichi-ken, JP;
Kazuya Goto, Irvine, CA (US);
Kazuki Koga, Aichi-ken, JP;
Mitsubishi Rayon Co., Ltd., Tokyo, JP;
Abstract
A method for producing a fiber-reinforced composite material plate by heating and pressurizing a prepreg for a molding time of 15 minutes or less, at a molding temperature of at least 120° C. and a molding pressure of at least 10 kg/cm. The prepreg is prepared from a reinforcing fiber and an epoxy resin composition. The epoxy resin composition features: an epoxy resin; an amine compound having at least one sulfur atom in the molecule thereof and/or a reaction product of the epoxy resin and the amine compound having at least one sulfur atom in the molecule thereof; a urea compound; and a dicyandiamide. The contents of the sulfur atom and the urea compound in the epoxy resin composition are respectively 0.2 to 7% by mass and 1 to 15% by mass.