The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7591911 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 22, 2009

Filed:

Sep. 29, 2006
Applicants:

Kazutaka Senda, Soka, JP;

Masaru Kato, Soka, JP;

Tetsuya Osaka, Tokyo, JP;

Yutaka Okinaka, Tokyo, JP;

Inventors:

Kazutaka Senda, Soka, JP;

Masaru Kato, Soka, JP;

Tetsuya Osaka, Tokyo, JP;

Yutaka Okinaka, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 45/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A gold-cobalt based amorphous alloy plated film consisting of a homogeneous amorphous phase not having microcrystals is formed by electroplating conducted by use of an electroplating bath containing a gold cyanide salt in a concentration of 0.01 to 0.1 mol/dmin terms of gold, a cobalt salt in a concentration of 0.02 to 0.2 mol/dmin terms of cobalt, and a tungstate in a concentration of 0.1 to 0.5 mol/dmin terms of tungsten. The gold-cobalt based amorphous alloy plated film obtained consists of a homogeneous amorphous phase not having microcrystals, and has an enhanced hardness while retaining the good contact resistance and chemical stability intrinsic of gold on such levels as to be free of problems on a practical use basis; therefore, the gold-cobalt based amorphous alloy plated film is effective for use as a contact material in electric and electronic component parts such as relays.


Find Patent Forward Citations

Senda, Kazutaka. (2009). Plated film of gold-cobalt amorphous alloy, electroplating bath, and method for electroplating (U.S. Patent No. 7591911). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7591911

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