The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2009
Filed:
Jun. 07, 2006
Hiroyuki Naito, Osaka, JP;
Satoshi Shida, Osaka, JP;
Yasuharu Ueno, Osaka, JP;
Makoto Morikawa, Nara, JP;
Hiroyuki Naito, Osaka, JP;
Satoshi Shida, Osaka, JP;
Yasuharu Ueno, Osaka, JP;
Makoto Morikawa, Nara, JP;
Panasonic Corporation, Osaka, JP;
Abstract
The semiconductor device bonding apparatusof the present invention includes: a pressing memberthat presses the semiconductor devicetoward the substrateside in a state where a bumpis provided between the semiconductor deviceand the substrate; an ultrasonic vibration applying memberthat vibrates the semiconductor deviceand the substraterelatively by applying an ultrasonic vibration to at least one of the semiconductor deviceand the substrate; a time measuring memberthat measures a required time period from a time when starting to apply the ultrasonic vibration to a time when the semiconductor deviceis pressed a predetermined distance; and a controlling memberthat controls an output of an ultrasonic vibration during subsequent bonding, based on the time period measured by the time measuring member