The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2009
Filed:
Dec. 08, 2003
Daniel J. Lenehan, Los Altos Hills, CA (US);
Kenneth Goodson, Belmont, CA (US);
Thomas W. Kenny, San Carlos, CA (US);
Mark Munch, Los Altos, CA (US);
Saroj Sahu, Fremont, CA (US);
Daniel J. Lenehan, Los Altos Hills, CA (US);
Kenneth Goodson, Belmont, CA (US);
Thomas W. Kenny, San Carlos, CA (US);
Mark Munch, Los Altos, CA (US);
Saroj Sahu, Fremont, CA (US);
Cooligy Inc., Mountain View, CA (US);
Abstract
A method of and apparatus for cooling heat-generating devices in a cooling system is disclosed. The apparatus includes various sensors, control schemes and thermal models, to control pump flow rates and fan flow rates to minimize power consumption, fan noise, and noise transients. The apparatus further includes at least one heat-generating device, at least one heat exchanger, and at least one heat rejector. The apparatus can also include many pumps and fans. The method includes controlling a fluid flow rate of at least one pump and an air flow rate of at least one fan, in a cooling system for cooling at least one device. The method comprises the steps of: providing at least one temperature sensor coupled to measure a temperature value of each device; receiving the temperature value from each temperature sensor; and providing a controller to selectively control the fluid flow rate and the air flow rate, based on each temperature value. The method can further include the step of filling at least a portion of a heat exchanger with a thermal capacitance medium for maintaining the temperature value of the device below a maximum allowable temperature during thermal transients, wherein the heat exchanger is thermally coupled to the device.