The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2009
Filed:
Apr. 12, 2006
Feng-ku Wang, Taipei, TW;
Yi-lun Cheng, Taipei, TW;
Chun-yi Chang, Taipei, TW;
Jui-chan Fan, Taipei, TW;
Chun-lung Lin, Taipei, TW;
Chih-kai Yang, Taipei, TW;
Feng-Ku Wang, Taipei, TW;
Yi-Lun Cheng, Taipei, TW;
Chun-Yi Chang, Taipei, TW;
Jui-Chan Fan, Taipei, TW;
Chun-Lung Lin, Taipei, TW;
Chih-Kai Yang, Taipei, TW;
Inventec Corporation, Taipei, TW;
Abstract
A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a hollow portion, a folding portion, and an adhesive area; wherein the hollow portion is used for surrounding the heat-conductive medium with a frame-fixing plate extending from its edge, which is folded towards an opposite direction of the heat-conductive medium, so as to keep an upright state; the folding portion is folded towards the hollow portion, so that the frame-fixing plate passes through the folding portion to clip and fix the folding portion, thus forming an accommodating space for protecting the heat-conductive medium; and the adhesive area is located at the edge of the hollow portion, facing the surface of the heat sink device, for adhering and securing the plate body to the heat sink device.